- Title
- Comparison of circular flexure hinge design equations and the derivation of empirical stiffness formulations
- Creator
- Yong, Yuen Kuan; Lu, Tien-Fu
- Relation
- 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. Proceedings of the IEEE/ASME International Conference on Advanced Intelligent Mechatronics 2009 (Singapore 14-17 July, 2009) p. 510-515
- Publisher Link
- http://dx.doi.org/10.1109/AIM.2009.5229961
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Resource Type
- conference paper
- Date
- 2009
- Description
- Flexure hinges are commonly used in many applications which require precise and smooth motions in the nanometer scale. There were various formulations derived using different methods to calculate the stiffness of circular flexure hinges. This article compares these equations with FEA predictions. The limitation of these equations at different t/R (R is the radius and t is the neck thickness) ratios are revealed. Based on the limitations of these design equations, a guideline to select the most accurate equations for hinge design calculations is presented. In addition to the review and comparisons, general empirical stiffness equations in the x- and y-direction were formulated in this study (with errors less than 3% when compared to FEA simulations) for a wide range of t/R ratios (0.05 les t/R les 0.8).
- Subject
- bending; design engineering; elasticity; fasteners; finite element analysis; nanotechnology; precision engineering
- Identifier
- http://hdl.handle.net/1959.13/918736
- Identifier
- uon:8695
- Identifier
- ISBN:9781424428533
- Rights
- Copyright © 2009 IEEE. Reprinted from the Proceedings of the IEEE/ASME International Conference on Advanced Intelligent Mechatronics 2009. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of University of Newcastle's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
- Language
- eng
- Full Text
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