Micro-void toughening of thermosets and its mechanism

Title: Micro-void toughening of thermosets and its mechanism
Creator: Kim, Nam Ho; Kim, Ho- Sung
Relation: Journal of Applied Polymer Science Vol. 98, no. 3, p. 1290-1295
Publisher: John Wiley & Sons
Resource Type: journal article
Date: 2005
Description: Void toughening is studied using epoxy resin. Voids were produced mechanically without any chemical agents so that it was possible to isolate the role of micro-voids from other factors. Toughness of the epoxy resin owing to voids was improved over that of the control by an order of magnitude. The toughening mechanism was found to be strongly related to intervoid distance and, hence, to void-to-crack distance. Large deformation bands between the crack and voids were deduced to be the source of toughening. The intervoid distance was directly measured on scanning electron microscope photos.
Subject: cavitation; fracture toughness; inter-void distance; shear deformation; toughening; void; elastomer-modified epoxies; toughness; polymers
Identifier: http://hdl.handle.net/1959.13/25352
Identifier: uon:328
Identifier: ISSN:1097-4628
Language: eng
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