Thermal analysis of piezoelectric benders with laminated power electronics

Title: Thermal analysis of piezoelectric benders with laminated power electronics
Creator: Fleming, Andrew J.; Yong, Yuen Kuan
Relation: 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics: Mechatronics for Human Wellbeing, AIM 2013. Proceedings of the 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics: Mechatronics for Human Wellbeing, AIM 2013 (Wollongong, Australia 09-12 July, 2013) p. 83-88
Publisher Link: http://dx.doi.org/10.1109/AIM.2013.6584072
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Resource Type: conference paper
Date: 2013
Description: This article explores the possibility of piezoelectric actuators with integrated high voltage power electronics. Such devices dramatically simplify the application of piezoelectric actuators since the power electronics are already optimized for the voltage range, capacitance, and power dissipation of the actuator. The foremost consideration is the thermal impedance of the actuator and heat dissipation. Analytical and finite-element methods are described for predicting the thermal impedance of a piezoelectric bender.
Subject: cooling; electric impedance; piezoelectric actuators; power electronics; thermal analysis
Identifier: http://hdl.handle.net/1959.13/1295136
Identifier: uon:18952
Identifier: ISBN:9781467353205
Language: eng
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